IP Library Assignment 042139/0692
Patent Assignment
Reel/Frame 042139/0692

Assignment of Assignor's Interest

Recorded: 2017-04-25 Pages: 3
Assignors
HAQ, JESMIN
Executed: 2017-03-21
ZHONG, TOM
Executed: 2017-03-21
TENG, ZHONGJIAN
Executed: 2017-03-21
SHEN, DONGNA
Executed: 2017-03-21
Assignee
HEADWAY TECHNOLOGIES, INC.
678 SOUTH HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
MTJ Device Process/Integration Method with Pre-Patterned Seed Layer
Patent: 9,972,777 →
Application: 15/479,497 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 25, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048692/0917 →