Patent Assignment
Reel/Frame 042142/0933
Assignment of Assignor's Interest
Recorded: 2017-04-25
Pages: 3
Assignee
STMICROELECTRONICS, INC.
NO. 9 MOUNTAIN DR., LIGHT INDUSTRY & SCIENCE PARK II, BRGY LA MESA, LAGUNA, CALAMBA CITY, 4027, PHILIPPINES
Covered Property
(1)
Leadframe Package with Side Solder Ball Contact and Method of Manufacturing
Patent:
9,972,558 →
Application:
15/479,068 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.