Patent Assignment
Reel/Frame 068025/0112
Assignment of Assignor's Interest
Recorded: 2024-07-18
Pages: 7
Assignor
STMICROELECTRONICS, INC.
Executed: 2024-07-01
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties
(29)
Leadless Semiconductor Package with Routable Leads, and Method of Manufacture
Compensating Mold Plunger for Integrated Circuit Manufacture
Method and System for Determining and Dispensing Resin for a Compression Molding Process Flow
Leadless Semiconductor Package and Method of Manufacture
Stacked Semiconductor Packages with Cantilever Pads
Method for Making Semiconductor Device with Sidewall Recess and Related Devices
Semiconductor Device with Frame Having Arms and Related Methods
Modified Leadframe Design with Adhesive Overflow Recesses
Leadframe Package with Side Solder Ball Contact and Method of Manufacturing
Patent:
9,972,558 →
Application:
15/479,068 →
Protection from Esd During the Manufacturing Process of Semiconductor Chips
Semiconductor Package with Individually Molded Leadframe and Die Coupled at Solder Balls
Method for Making Semiconductor Device with Sidewall Recess and Related Devices
Semiconductor Device with Frame Having Arms and Related Methods
Leadframe Package with Side Solder Ball Contact and Method of Manufacturing
Modified Leadframe Design with Adhesive Overflow Recesses
Leadframe Package with Side Solder Ball Contact and Method of Manufacturing
Protection from Esd During the Manufacturing Process of Semiconductor Chips
Semiconductor Package Having Die Pad with Cooling Fins
Semiconductor Die with Multiple Contact Pads Electrically Coupled to a Lead of a Lead Frame
Semiconductor Package Having a Semiconductor Die on a Plated Conductive Layer
Compact Leadframe Package
Modified Leadframe Design with Adhesive Overflow Recesses
Leadframe Package with Side Solder Ball Contact and Method of Manufacturing
Modified Leadframe Design with Adhesive Overflow Recesses
Semiconductor Device with Frame Having Arms
Semiconductor Die with Multiple Contact Pads Electrically Coupled to a Lead of a Lead Frame
Semiconductor Package Having Die Pad with Cooling Fins
Compact Leadframe Package
Multidie Flip Chip Package with Heat Sink
Application:
63/599,651 →
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 11, 2011
From: TAN, JERRY; CABREROS, WILLIAM
To: STMICROELECTRONICS, INC.
Reel/Frame 025938/0783 →
Assignment of Assignor's Interest
Feb 8, 2012
From: CADAG, AARON; ANG, BERNIECHRISANTO; LAYLO, RICHARD
To: STMICROELECTRONICS, INC.
Reel/Frame 027674/0287 →
Assignment of Assignor's Interest
Oct 15, 2012
From: CARINO, WILJEE; ANG, BERNIE CHRISANTO; LAYLO, RICHARD
To: STMICROELECTRONICS INC.
Reel/Frame 029126/0419 →
Assignment of Assignor's Interest
May 27, 2015
From: TALLEDO, JEFFERSON; DIMAYUGA, GODFREY
To: STMICROELECTRONICS, INC.
Reel/Frame 035720/0596 →
Assignment of Assignor's Interest
Sep 2, 2015
From: TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 036473/0840 →
Assignment of Assignor's Interest
Dec 7, 2015
From: TALLEDO, JEFFERSON; SEGUIDO, RAMMIL
To: STMICROELECTRONICS, INC.
Reel/Frame 037229/0144 →
Assignment of Assignor's Interest
Jan 5, 2017
From: RODRIGUEZ, RENNIER; AGUDON, AIZA MARIE; TALLEDO, JEFFERSON; MANALO, MOONLORD
To: STMICROELECTRONICS, INC.
Reel/Frame 040866/0250 →
Assignment of Assignor's Interest
Apr 25, 2017
From: TALLEDO, JEFFERSON; MANGAOANG, TITO
To: STMICROELECTRONICS, INC.
Reel/Frame 042142/0933 →
Assignment of Assignor's Interest
Jun 29, 2017
From: GOMEZ, FREDERICK RAY; MANGAOANG, TITO, JR.; TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 042870/0094 →
Assignment of Assignor's Interest
Aug 15, 2017
From: TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 043300/0254 →