IP Library Granted Patent US 9,011,127
Granted Patent B2
US 9,011,127 · App. 13/586,749 · Granted Apr 21, 2015

Method and system for determining and dispensing resin for a compression molding process flow

Inventors: Wiljee Carino (Cabuyao, PH); Bernie Chrisanto Ang (Sto. Tomas, PH); Richard Laylo (Calamba, PH)
Assignee: STMicroelectronics Inc.
B29C43/58B29C31/006B29C31/008B29C2043/5833B29C2043/5841B29C2037/903B29C2037/906B29C2037/80B29C2043/5875
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Quick Facts
Patent No.
US 9,011,127
App. No.
13/586,749
Granted
Apr 21, 2015
Kind
B2
Abstract

The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound.

Claims (47)

1. A method, comprising:

forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier, the forming including:

providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier, the providing including:

accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium;

determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier; and

molding the unpackaged dice into the packaged dice using the quantity of molding compound.

2. The method of claim 1 wherein the indication is a digital value stored in the storage medium.

3. The method of claim 2 wherein accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium includes:

retrieving the digital value by reading the storage medium;

transmitting the digital value to a server, the server being configured to store the total number of the unpackaged dice based on the digital value in a memory; and

receiving the total number of the unpackaged dice on the carrier from the server.

4. The method of claim 2 wherein the digital value represents the total number of the unpackaged dice.

5. The method of claim 4 wherein accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium includes retrieving the digital value by scanning the storage medium.

6. The method of claim 1 wherein the storage medium is a marking on the carrier.

7. The method of claim 6 wherein accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium includes scanning the marking.

8. The method of claim 1 wherein forming the plurality of packaged dice on the carrier includes:

attaching the unpackaged dice to die pads of a frame on the carrier;

counting the dice as the dice are attached to the frame; and

storing the total number of the unpackaged dice on the storage medium.

9. The method of claim 8 wherein storing the total number of the unpackaged dice includes:

determining the indication by scanning the storage medium; and

storing the total number of dice based on the indication in a memory.

10. The method of claim 8 , further comprising coding the indication into the storage medium.

11. The method of claim 10 wherein the indication is a digital value.

12. A system, comprising:

a compression molding device configured to form a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier, the device being configured to:

access the indication of the total number of unpackaged dice on the carrier from the storage medium;

determine a quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier; and

mold the unpackaged dice into the packaged dice with the quantity of molding compound.

13. The system of claim 12 wherein the device is configured to request the total number of the unpackaged dice by transmitting the indication to a server, the server being configured to store the total number of the unpackaged dice associated with the indication in a memory, the device being configured to receive the total number of the unpackaged dice on the carrier from the server.

14. The system of claim 12 wherein the device is configured to read the indication from the storage medium to access the total number of the unpackaged dice on the carrier.

15. The system of claim 12 being further configured to:

attach the total number of the unpackaged dice to die pads of a frame on the carrier;

count the dice as the dice are attached to the frame; and

store the total number of the unpackaged dice on the storage medium.

16. The system of claim 15 being further configured to:

scan the storage medium to determine the indication; and

store the total number of the unpackaged dice based on the indication in a memory.

17. The system of claim 16 being further configured to:

request the total number of the unpackaged dice from the memory using the indication; and

receive the total number of the unpackaged dice on the carrier from the server.

18. A device, comprising:

a carrier;

a frame on the carrier, the frame configured to receive a plurality of unpackaged dice; and

a storage medium on the carrier, the storage medium being configured to store an indication of a total number of unpackaged dice received by the carrier.

19. The device of claim 18 , wherein the storage medium is a physical marking on the carrier and the indication is coded into the marking.

20. The device of claim 18 , wherein the indication is a digital value stored in the storage medium.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2024
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068025/0112 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2012
From: CARINO, WILJEE; ANG, BERNIE CHRISANTO; LAYLO, RICHARD
To: STMICROELECTRONICS INC.
Reel/Frame 029126/0419 →
Continuity (1)
Related Publication 20140048976A1 · Feb 20, 2014