Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
The present disclosure is directed to a semiconductor die with multiple contact pads electrically coupled to a single lead via a single wire, and methods for fabricating the same. In one or more embodiments, multiple contact pads are electrically coupled to each other by a plurality of conductive layers stacked on top of each other. The uppermost conductive layer is then electrically coupled to a single lead via a single wire.
1. A device, comprising:
a frame including a lead;
a die including a first contact pad and a second contact pad;
a first conductive bump on the first contact pad;
a second conductive bump on the second contact pad;
a third conductive bump on a surface of the first conductive bump and a surface of the second conductive bump, the third conductive bump partially covering the surface of the first conductive bump and the surface of the second conductive bump; and
a wire coupled to the third conductive bump and the lead.
2. The device of claim 1 wherein the die includes a third contact pad, and the device further includes:
a fourth conductive bump on the third contact pad; and
a fifth conductive bump on the surface of the second conductive bump and a surface of the fourth conductive bump, the fifth conductive bump partially covering the surface of the second conductive bump and the surface of the fourth conductive bump.
3. The device of claim 2 , further comprising:
a second wire coupled to the fifth conductive bump and the lead.
4. The device of claim 2 wherein the frame includes another lead, and the device further includes:
a second wire coupled to the fifth conductive bump and the another lead.
5. The device of claim 1 wherein the first conductive bump and the second conductive bump are coplanar.
6. The device of claim 1 wherein the first and second conductive bumps are in a first plane, and the third conductive bump is in a second plane different from the first plane.
7. The device of claim 1 wherein the first contact pad and the second contact pad are on the same surface of the die.
8. A method, comprising:
positioning a die on a frame, the die including a first contact pad and a second contact pad, the frame including a lead;
forming a first conductive bump on the first contact pad;
forming a second conductive bump on the second contact pad;
forming a third conductive bump on a surface of the first conductive bump and a surface of the second conductive bump, the third conductive bump partially covering the surface of the first conductive bump and the surface of the second conductive bump; and
coupling a wire to the third conductive bump and the lead.
9. The method of claim 8 wherein the die includes a third contact pad, and the method further includes:
forming a fourth conductive bump on the third contact pad; and
forming a fifth conductive bump on the surface of the second conductive bump and a surface of the fourth conductive bump, the fifth conductive bump partially covering the surface of the second conductive bump and the surface of the fourth conductive bump.
10. The method of claim 9 , further comprising:
coupling a second wire to the fifth conductive bump and the lead.
11. The method of claim 9 wherein the frame includes another lead, and the method further includes:
coupling a second wire to the fifth conductive bump and the another lead.
12. The method of claim 8 wherein the first conductive bump and the second conductive bump are coplanar.
13. The method of claim 8 wherein the first and second conductive bumps are in a first plane, and the third conductive bump is in a second plane different from the first plane.
14. The method of claim 8 wherein the first contact pad and the second contact pad are on the same surface of the die.
15. A device, comprising:
a frame including a lead;
a die including a first contact pad and a second contact pad;
a first conductive bump on the first contact pad;
a second conductive bump on the second contact pad and abutting the first conductive bump;
a third conductive bump on the first conductive bump and the second conductive bump; and
a wire coupled to the third conductive bump and the lead.
16. The device of claim 15 wherein the die includes a third contact pad, and the device further includes:
a fourth conductive bump on the third contact pad, the fourth conductive bump abutting the second conductive bump; and
a fifth conductive bump on the second conductive bump and the fourth conductive bump.
17. The device of claim 16 , further comprising:
a second wire coupled to the fifth conductive bump and the lead.
18. The device of claim 16 wherein the frame includes another lead, and the device further includes:
a second wire coupled to the fifth conductive bump and the another lead.
19. The device of claim 15 wherein the first conductive bump and the second conductive bump are coplanar.
20. The device of claim 15 wherein the first and second conductive bumps are in a first plane, and the third conductive bump is in a second plane different from the first plane.