Compact leadframe package

1. A semiconductor package, comprising:

a die pad having an inner portion and an outer portion, the inner portion including an inner perimeter portion, the outer portion including an outer perimeter portion, the inner perimeter portion extending beyond the outer perimeter portion, the inner perimeter portion including a plurality of protrusions spaced apart from each other by recesses;

a semiconductor die coupled to the inner portion of the die pad;

a plurality of leads, each lead including an upper portion and a base portion, the base portions extending laterally towards the die pad and beyond the upper portions, wherein the base portions of the plurality of leads are staggered relative to the plurality of protrusions of the inner perimeter portion of the die pad such that each base portion faces the outer perimeter portion of outer portion of the die pad at a-respective recesses;

a plurality of conductive wires, the semiconductor die electrically coupled to the plurality of leads by the plurality of conductive wires, respectively; and

encapsulation material over the plurality of leads, the die pad, the semiconductor die, and the plurality of conductive wires, wherein a surface of the outer portion of the die pad and surfaces of the base portions of the plurality of leads are exposed at an outer surface of the semiconductor package.

2. The semiconductor package of claim 1 , wherein the upper portions of the plurality of leads have a first width that extends between adjacent leads, wherein the base portions of the plurality of leads have a second width that extends between adjacent leads, wherein the second width is less than the first width.

3. The semiconductor package of claim 2 , wherein upper portions of the plurality of leads extend beyond opposing sides of the base portions form lead locks that aid in locking the plurality of leads in the encapsulation material.

4. The semiconductor package of claim 3 , wherein the upper portions of the plurality of leads are spaced apart from the base portions by central portions, wherein the central portions have same widths in a width direction as the upper portions.

5. The semiconductor package of claim 1 , wherein a minimum distance between each lead and the die pad is at least 0.15 mm.

6. The semiconductor package of claim 1 , wherein the plurality of protrusions extend from a portion of the inner perimeter portion of the die pad.

7. The semiconductor package of claim 1 , wherein the base portions of the plurality of leads include a central portion that separates the upper portion from a surface of the base portion that extends beyond the upper portion toward the die pad.

8. A semiconductor package comprising:

a die pad having an inner portion and an outer portion, the inner portion including an inner perimeter portion, the outer portion including an outer perimeter portion, the inner perimeter portion extending beyond the outer perimeter portion, the inner perimeter portion including a plurality of protrusions spaced apart from each other by recesses;

a semiconductor die coupled to the inner portion of the die pad;

a plurality of leads, each lead including an upper portion and a base portion, wherein the base portions of the leads are staggered relative to the plurality of protrusions of the inner perimeter portion of the die pad such that each base portion faces a respective recesses;

a plurality of conductive wires, the semiconductor die electrically coupled to the plurality of leads by the plurality of conductive wires, respectively; and

encapsulation material over the plurality of leads, the die pad, the semiconductor die, and the plurality of conductive wires, wherein a surface of the outer portion of the die pad and surfaces of the base portions of the plurality of leads are exposed at an outer surface of the semiconductor package,

wherein the base portions of the plurality of leads are less than 50% a total thickness of the plurality of leads, wherein the inner perimeter portion of the die pad is less than 50% a total thickness of the die pad.

9. A semiconductor package of comprising:

a die pad having an inner portion and an outer portion, the inner portion including an inner perimeter portion, the outer portion including an outer perimeter portion, the inner perimeter portion extending beyond the outer perimeter portion, the inner perimeter portion including a plurality of protrusions spaced apart from each other by recesses;

a semiconductor die coupled to the inner portion of the die pad;

a plurality of leads, each lead including an upper portion and a base portion, wherein the base portions of the leads are staggered relative to the plurality of protrusions of the inner perimeter portion of the die pad such that each base portion faces a respective recesses;

a plurality of conductive wires, the semiconductor die electrically coupled to the plurality of leads by the plurality of conductive wires, respectively; and

encapsulation material over the plurality of leads, the die pad, the semiconductor die, and the plurality of conductive wires, wherein a surface of the outer portion of the die pad and surfaces of the base portions of the plurality of leads are exposed at an outer surface of the semiconductor package,

wherein a minimum distance between the plurality of leads and the die pad is between the base portions of the plurality of leads and the inner perimeter portion of the die pad.

10. A semiconductor package, comprising:

a die pad having an inner portion and an outer portion, the inner portion being larger than the outer portion, wherein the inner portion includes a plurality of protrusions along a first side of the die pad, wherein the plurality of protrusions form recesses between adjacent protrusions;

a semiconductor die coupled to the inner portion of the die pad;

a plurality of leads facing the first side of the die pad, the plurality of leads including upper portions and base portions, wherein the base portions of the plurality of leads are staggered relative to the plurality of protrusions of the inner portion of the die pad, wherein the upper portions form lead locks extending in a direction of adjacent leads;

a plurality of conductive wires, the semiconductor die electrically coupled to the plurality of leads by the plurality of conductive wires, respectively; and

encapsulation material over the plurality of leads, the die pad, the semiconductor die, and the plurality of conductive wires, wherein a surface of the outer portion of the die pad and surfaces of the base portions of the plurality of leads are exposed at an outer surface of the semiconductor package,

wherein the upper portions of the plurality of leads extend beyond the base portions of the plurality of leads on opposing sides of the upper portions, and

wherein the base portions of the plurality of leads face the outer portion of the die pad and are aligned relative to the recesses between adjacent protrusions.

11. The semiconductor package of claim 10 , wherein a shortest distance between each of the plurality of leads and the die pad is at least 0.15 mm.

12. The semiconductor package of claim 10 , wherein the lead locks are formed by upper portions of the plurality of leads having widths that are greater than widths of the base portions of the plurality of leads.

13. A semiconductor package, comprising:

a die pad having an inner portion and outer portion, wherein the inner portion has a perimeter that includes a plurality of protrusions spaced apart from each other by recesses;

a semiconductor die coupled to the die pad;

a plurality of leads arranged around the perimeter of the die pad, each lead including an upper portion and a base portion, the base portions extending laterally towards the die pad and beyond the upper portions, each base portion facing the outer portion of the die pad and being arranged between a respective recess of the plurality of recesses of the inner portion such that each protrusion of the plurality of protrusions are arranged between adjacent leads of the plurality of leads; and

encapsulation material the die pad and the semiconductor die and along side surfaces of the plurality of leads.

14. The semiconductor package of claim 13 , comprising a plurality of conductive wires, wherein the semiconductor die is electrically coupled to the plurality of leads by the plurality of conductive wires, respectively.

15. The semiconductor package of claim 13 , wherein the upper portion of each lead has a first width, wherein the base portion of each lead has a second width, wherein the first width is greater than the second width.

16. The semiconductor package of claim 13 , wherein upper portion of each lead acts as an anchor embedding the respective lead of the plurality of leads in the encapsulation material.