Patent Assignment
Reel/Frame 043300/0254
Assignment of Assignor's Interest
Recorded: 2017-08-15
Pages: 3
Assignor
TALLEDO, JEFFERSON
Executed: 2017-07-28
Assignee
STMICROELECTRONICS, INC.
NO. 9 MOUNTAIN DRIVE, LIGHT INDUSTRY &, SCIENCE PARK II, BRGY LA MESA, LAGUNA, CALAMBA CITY, 4027, PHILIPPINES
Covered Property
(1)
Semiconductor Package with Individually Molded Leadframe and Die Coupled at Solder Balls
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.