Modified leadframe design with adhesive overflow recesses
The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.
1. A method, comprising:
attaching a semiconductor die to a leadframe main body at a center die pad on a first side of the leadframe main body, the first side of the leadframe main body including the center die pad and a recess portion surrounding the center die pad, the center die pad having a length and a width and protruding upward from the recess portion,
wherein the semiconductor die includes a length greater than the length of the center die pad and a width greater than the width of the center die pad.
2. The method of claim 1 wherein the attaching the semiconductor die to the leadframe main body includes attaching the semiconductor die to the leadframe main body using a die attachment medium between the semiconductor die and the leadframe main body.
3. The method of claim 1 wherein the attaching the semiconductor die to the leadframe main body includes receiving overflow of the die attachment medium in the recess portion.
4. The method of claim 1 wherein the attaching the semiconductor die to the leadframe main body includes attaching the semiconductor die to the leadframe main body that includes an edge portion surrounding the recess portion, the edge portion protruding upward from the recess portion.
5. The method of claim 4 wherein the edge portion has a height that is substantially same as a height of the center die pad.
6. The method of claim 1 wherein the attaching the semiconductor die to the leadframe main body includes attaching the semiconductor die to the leadframe main body that includes an overhang portion at an edge of the leadframe main body.
7. A method, comprising:
positioning a semiconductor die over a first portion of a die pad, the die pad having the first portion and a second portion laterally surrounding the first portion, the first portion having a first height, the second portion extending from the first portion toward an edge of the die pad and having a second height that is lower than the first height,
wherein after the positioning, an edge of the semiconductor die protrudes laterally beyond the first portion of the die pad and overlaps the second portion of the monolithic die pad.
8. The method of claim 7 wherein the positioning the semiconductor die over the first portion of the die pad includes positioning the semiconductor die over the die pad that includes a third portion laterally surrounding the second portion, and wherein after the positioning, the third portion of the die pad laterally protrudes beyond the semiconductor die.
9. The method of claim 8 wherein after the positioning, the second portion of the die pad laterally protrudes beyond the semiconductor die.
10. The method of claim 7 wherein the positioning the semiconductor die over the first portion of the die pad includes positioning an adhesive between the semiconductor die and the first portion of the die pad.
11. The method of claim 10 wherein after the positioning, the adhesive encapsulates a border line between the first portion and the second portion of the die pad.
12. The method of claim 10 wherein after the positioning, overflow of the adhesive is received in the second portion of the die pad.
13. A method, comprising:
applying a die attachment medium on a central portion of a die pad, the die pad having the central portion, a peripheral portion laterally surrounding the central portion, and a trench portion between the central portion and the peripheral portion; and
positioning a semiconductor die on the die attachment medium, overflow of the die attachment medium being received in the trench portion.
14. The method of claim 13 wherein the applying the die attachment medium on the central portion of the die pad includes applying the die attachment medium on the central portion of the die pad that includes the peripheral portion and the central portion having substantially a same height.
15. The method of claim 13 wherein after the positioning the semiconductor die on the die attachment medium, an edge of the semiconductor die protrudes laterally beyond the central portion of the die pad.
16. The method of claim 13 wherein after the positioning the semiconductor die on the die attachment medium, an edge of the semiconductor die overlaps the trench portion of the die pad.
17. The method of claim 13 wherein after the positioning the semiconductor die on the die attachment medium, the peripheral portion of the die pad is free of the die attachment medium.
18. The method of claim 13 wherein the applying the die attachment medium on the central portion of the die pad includes applying an adhesive on the central portion of the die pad.
19. The method of claim 13 wherein the applying the die attachment medium on the central portion of the die pad includes applying the die attachment medium on the central portion of the die pad whose peripheral portion includes an overhang portion pointing away from the central portion of the die pad.
20. The method of claim 19 wherein the peripheral portion includes a recess portion under the overhang portion.