Patent Assignment
Reel/Frame 042148/0995
Assignment of Assignor's Interest
Recorded: 2017-04-26
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Conductive Powder Formation Method, Device for Forming Conductive Powder, and Method of Forming Semiconductor Device