IP Library Assignment 042154/0546
Patent Assignment
Reel/Frame 042154/0546

Assignment of Assignor's Interest

Recorded: 2017-03-27 Pages: 4
Assignors
VINCENT, MICHAEL B.
Executed: 2014-06-25
HAYES, SCOTT M.
Executed: 2014-06-25
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property (1)
Microelectronic Packages Having Embedded Sidewall Substrates and Methods for the Producing Thereof
Patent: 9,761,565 →
Application: 15/418,845 →
Publication: US 2017/0141084
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Mar 23, 2017
From: NXP SEMICONDUCTORS USA INC.; FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 041800/0283 →