Patent Assignment
Reel/Frame 042302/0431
Assignment of Assignor's Interest
Recorded: 2017-05-09
Pages: 7
Assignors
CHAN, TIEN-CHEN
Executed: 2016-06-30
LI, YI-FAN
Executed: 2016-06-30
CHEN, YEN-HSING
Executed: 2016-06-30
CHEN, CHUN-YU
Executed: 2016-06-30
HUANG, CHUNG-TING
Executed: 2016-06-30
HUANG, ZIH-HSUAN
Executed: 2016-06-30
CHANG, MING-HUA
Executed: 2016-06-30
LIN, YU-SHU
Executed: 2016-06-30
CHAN, SHU-YEN
Executed: 2016-06-30
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Device Having Silicon-Germanium Layer on Fin and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.