Patent Assignment
Reel/Frame 042376/0606
Assignment of Assignor's Interest
Recorded: 2017-05-15
Pages: 6
Assignors
LEE, YI-JING
Executed: 2017-05-04
YU, JENG-WEI
Executed: 2017-05-05
CHOU, LI-WEI
Executed: 2017-05-04
KWOK, TSZ-MEI
Executed: 2017-05-04
YU, MING-HUA
Executed: 2017-05-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having Merged Epitaxial Features with Arc-Like Bottom Surface and Method of Making the Same