IP Library Assignment 042380/0665
Patent Assignment
Reel/Frame 042380/0665

Assignment of Assignor's Interest

Recorded: 2017-05-15 Pages: 5
Assignors
BYUN, DAE JUNG
Executed: 2017-04-17
KIM, BYUNG HO
Executed: 2017-04-17
HAN, PYUNG HWA
Executed: 2017-04-17
CHOI, JOO YOUNG
Executed: 2017-04-17
SHIN, UNG HUI
Executed: 2017-04-17
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 15/595,226 →
Publication: US 2018/0061795
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →