Patent Assignment
Reel/Frame 042435/0014
Assignment of Assignor's Interest
Recorded: 2017-05-19
Pages: 3
Assignee
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI, KYOTO-FU, 617-8555, JAPAN
Covered Property
(1)
Method for Bonding Wafers