Patent Assignment
Reel/Frame 042476/0878
Assignment of Assignor's Interest
Recorded: 2017-05-23
Pages: 6
Assignors
KIM, JUN HYUNG
Executed: 2017-03-10
KIM, SEOKHO
Executed: 2017-03-31
KIM, SUNGHYUP
Executed: 2017-03-10
KIM, JAEGEUN
Executed: 2017-03-10
KIM, TAEYEONG
Executed: 2017-03-30
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Bonding Apparatus Having Adsorption Sectors with Different Vacuum Pressures and Method of Manufacturing Semiconductor Device Using the Same