Patent Assignment
Reel/Frame 042499/0647
Assignment of Assignor's Interest
Recorded: 2017-05-24
Pages: 4
Assignors
HWANG, JIN HA
Executed: 2017-05-22
PARK, DAE BUM
Executed: 2017-05-10
CHOO, YONG JO
Executed: 2017-05-10
KIM, HYUN SUK
Executed: 2017-05-22
PARK, DA HEE
Executed: 2017-05-22
KO, MYEONG HEE
Executed: 2017-05-22
KWON, KYOUNG WOO
Executed: 2017-05-22
HWANG, HEE SU
Executed: 2017-05-22
CHOI, JEONG WAN
Executed: 2017-05-22
Assignees
HONGIK UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
(SANGSU-DONG, MUNHEONGWAN) 805-HO, 94, WAUSAN-RO, MAPO-GU, SEOUL, 121-791, KOREA, REPUBLIC OF
MAX TECH CO., LTD.
(SAMJEONG-DONG, BUCHEON TECHNOPARK) 304-301, 302, 345, SEOKCHEON-RO, OJEONG-GU, BUCHEON-SI, GYEONGGI-DO, 421-741, KOREA, REPUBLIC OF
Covered Property
(1)
Laminated Ceramic Chip Component Including Nano Thin Film Layer, Manufacturing Method Therefor, and Atomic Layer Vapor Deposition Apparatus Therefor