Patent Assignment
Reel/Frame 042501/0072
Assignment of Assignor's Interest
Recorded: 2017-05-25
Pages: 2
Assignor
KOBAYASHI, MITSURU
Executed: 2017-01-20
Assignee
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
1-61, SHIROMI 2-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, 540-6207, JAPAN
Covered Property
(1)
Three-Dimensional Circuit Substrate and Sensor Module Using Three-Dimensional Circuit Substrate