Three-dimensional circuit substrate and sensor module using three-dimensional circuit substrate
View Patent ↗A three-dimensional circuit substrate according to the present disclosure includes a base body and a wiring pattern formed on an outer surface of the base body. Also, the outer surface of the base body includes a mounting surface which faces the substrate when the three-dimensional circuit substrate is mounted onto the substrate, and an installation surface which is different from the mounting surface and is a surface where an electronic component is installable. Further, a recess is formed on a side where the mounting surface is provided in the base body.
1. A three-dimensional circuit substrate formed so as to be mountable onto a substrate, comprising:
a base body; and
a wiring pattern formed on an outer surface of the base body, wherein
the outer surface of the base body includes:
a mounting surface which faces the substrate when the three-dimensional circuit substrate is mounted onto the substrate; and
an installation surface which is different from the mounting surface and is a surface where an electronic component is installable, and
a first recess is formed on a first side where the mounting surface is provided in the base body
wherein
the base body includes a fitting part which is formed so as to be fittable into a fitted part formed on the substrate.
2. The three-dimensional circuit substrate according to claim 1 , wherein
the wiring pattern is formed on the installation surface and an inner front surface of the first recess.
3. The three-dimensional circuit substrate according to claim 1 , wherein
a wiring pattern which is to be soldered to the substrate is formed in the fitting part.
4. The three-dimensional circuit substrate according to claim 1 , wherein
the installation surface and the mounting surface overlap each other as viewed from a thickness direction of the substrate.
5. A sensor module including the three-dimensional circuit substrate according to claim 1 .
6. The three-dimensional circuit substrate according to claim 1 , wherein
a second recess is formed on a second side where the installation surface is provided in the base body, a photoelectric conversion element can be provided in the second recess and
a third recess is formed on the second side where the installation surface is provided in the base body, a light receiving element can be provided in the third recess.
7. The three-dimensional circuit substrate according to claim 1 , further comprising:
a second recess formed on a second side where the installation surface is provided in the base body; and
a cover member covering the installation surface, the cover member including a translucent window covering the second recess.
8. A three-dimensional circuit substrate formed so as to be mountable onto a substrate, comprising:
a base body; and
a wiring pattern formed on an outer surface of the base body, wherein
the outer surface of the base body includes:
a mounting surface which faces the substrate when the three-dimensional circuit substrate is mounted onto the substrate; and
an installation surface which is different from the mounting surface and is a surface where an electronic component is installable, and
a first recess is formed on a first side where the mounting surface is provided in the base body
a second recess is formed on a second side where the installation surface is provided in the base body,
the second recess is upwardly open, and has an approximately truncated-conical shape of which a diameter increases toward a top of the second recess.
9. The three-dimensional circuit substrate according to claim 8 , wherein
a photoelectric conversion element can be provided in the second recess.
10. The three-dimensional circuit substrate according to claim 9 , further comprising:
a cover member covering the second recess and the installation surface.
11. The three-dimensional circuit substrate according to claim 8 ,
wherein
the wiring pattern is formed on the installation surface and an inner front surface of the first recess.
12. The three-dimensional circuit substrate according to claim 8 ,
wherein
the base body includes a fitting part which is formed so as to be fittable into a fitted part formed on the substrate.
13. The three-dimensional circuit substrate according to claim 12 ,
wherein
a wiring pattern which is to be soldered to the substrate is formed in the fitting part.
14. The three-dimensional circuit substrate according to claim 8 ,
wherein
the installation surface and the mounting surface overlap each other as viewed from a thickness direction of the substrate.
15. A sensor module including the three-dimensional circuit substrate according to claim 8 .
16. The three-dimensional circuit substrate according to claim 8 , wherein
a third recess is formed on the second side where the installation surface is provided in the base body, and
a light receiving element can be provided in the third recess.
17. The three-dimensional circuit substrate according to claim 10 , wherein the cover member includes a translucent window covering the second recess.
18. The three-dimensional circuit substrate according to claim 16 , further comprising a cover member including a translucent window covering the second recess or the third recess.