Patent Assignment
Reel/Frame 042517/0832
Assignment of Assignor's Interest
Recorded: 2017-05-26
Pages: 2
Assignee
GOERTEK, INC.
268 DONGFANG ROAD, HI-TECH INDUSTRY DISTRICT, WEIFANG CITY, SHANDONG, 261031, CHINA
Covered Property
(1)
Assembling Method, Manufacturing Method, Device and Electronic Apparatus of Flip-Die
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.