Assembling method, manufacturing method, device and electronic apparatus of flip-die

1. A method for assembling a flip-die, comprising:

temporarily bonding the flip-die onto a laser-transparent first substrate, wherein bumps of the flip-die are located on the side of the flip-die opposite to the first substrate;

testing the flip-die on the first substrate to determine a known-good-device for lift-off;

aligning the bumps with pads on a receiving substrate;

irradiating the first substrate with laser from the first substrate side to lift-off the flip-die from the first substrate; and

attaching the flip-die on the receiving substrate for finishing the assembling.

2. The method according to claim 1 , wherein the step of aligning the bumps with pads on a receiving substrate further comprises: flipping over the first substrate.

3. The method according to claim 1 , wherein the bumps are solder bumps, and the step of attaching the flip-die on the receiving substrate further comprises:

attaching the flip-die on the receiving substrate by using flux.

4. The method according to claim 1 , wherein the step of attaching the flip-die on the receiving substrate further comprises: attaching the flip-die on the receiving substrate by means of the action of gravity.

5. The method according to claim 1 , wherein the flip-die contains magnetic substance, and the step of attaching the flip-die on the receiving substrate further comprises: attaching the flip-die on the receiving substrate by means of the action of electromagnetic force.

6. The method according to claim 1 , wherein the bumps are solder bumps, and the method further comprises:

reflowing the solder bumps to bond the flip-die with the receiving substrate; and

underfilling the bottom of the flip-die.

7. The method according to claim 1 , wherein the flip-die is temporarily bonded on the first substrate through a temporary bonding layer, and the method further comprising: removing the temporary bonding layer.

8. The method according to claim 1 , further comprising:

forming a device wafer with bumps on one side;

wherein the step of temporarily bonding the flip-die onto a laser-transparent first substrate further comprises:

temporarily bonding the device wafer onto the first substrate on the other side of the flip-die; and

singulating the device wafer into the flip-die.

9. The method according to claim 8 , wherein the step of singulating the device wafer is performed by laser scribing, mechanical blade sawing, or etching.

10. The method according to claim 1 , wherein the step of attaching the flip-die on the receiving substrate further comprises: attaching the flip-die on the receiving substrate by means of the action of electrostatic force.

11. The method according to claim 10 , wherein the electrostatic force is applied by applying voltage to the pads.

12. The method according to claim 1 , wherein the step of attaching the flip-die on the receiving substrate further comprises: attaching the flip-die on the receiving substrate through an anisotropic conductive layer;

wherein the method further comprises: processing the anisotropic conductive layer to bond the flip-die with the receiving substrate.

13. The method according to claim 12 , wherein the anisotropic conductive layer is at least one of an anisotropic conductive film, an anisotropic conductive paste and an anisotropic conductive tape.

14. A method for manufacturing a flip-die device, comprising assembling a flip-die to a receiving substrate by using the method according to claim 1 .

15. A flip-die device, which is manufactured by using the method according to claim 14 .