Patent Assignment
Reel/Frame 042593/0383
Assignment of Assignor's Interest
Recorded: 2017-06-05
Pages: 3
Assignors
ARIMOTO, SHINJI
Executed: 2017-01-18
FUJIWARA, TAKENORI
Executed: 2017-01-12
TOMIKAWA, MASAO
Executed: 2017-01-16
Assignee
TORAY INDUSTRIES, INC.
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, 1038666, JAPAN
Covered Property
(1)
Adhesive for Temporary Bonding, Adhesive Layer, Wafer Work Piece and Method for Manufacturing Semiconductor Device Using Same, Rework Solvent, Polyimide Copolymer, Polyimide Mixed Resin, and Resin Composition (as Amended)