IP Library Assignment 042657/0315
Patent Assignment
Reel/Frame 042657/0315

Assignment of Assignor's Interest

Recorded: 2017-06-09 Pages: 4
Assignors
HUANG, CHE-HSUAN
Executed: 2017-06-08
CHANG, SHU-HSIU
Executed: 2017-06-08
SU, HSIN-LUN
Executed: 2017-06-08
LIN, CHIH-HAO
Executed: 2017-05-11
TSAI, TZONG-LIANG
Executed: 2017-05-30
Assignee
LEXTAR ELECTRONICS CORPORATION
NO.3, GONGYE E. 3RD RD., HSINCHU SCIENCE PARK, HSINCHU, 30075, TAIWAN
Covered Property (1)
Light Emitting Diode Chip Scale Packaging Structure
Application: 15/618,190 →
Publication: US 2017/0358709
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →