Patent Assignment
Reel/Frame 042663/0705
Assignment of Assignor's Interest
Recorded: 2017-06-09
Pages: 3
Assignors
LIU, YEN-CHENG
Executed: 2017-05-19
HSIEH, CHENG-YU
Executed: 2017-05-19
TSAI, SHANG-YING
Executed: 2017-05-19
CHANG, KUEI-SUNG
Executed: 2017-05-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductive Structure and Manufacturing Method Thereof