IP Library › Assignment 042669/0176
Patent Assignment
Reel/Frame 042669/0176

Assignment of Assignor's Interest

Recorded: 2017-06-01 Pages: 3
Assignors
LIU, YUPING
Executed: 2017-05-19
LONG, WEI
Executed: 2017-05-19
Assignee
SHENZHEN HUIDING TECHNOLOGY CO., LTD.
FLOOR 13, PHASE B, TENGFEI INDUSTRIAL BUILDING, FUTIAN FREE TRADE ZONE, SHENZHEN, 518000, CHINA
Covered Property (1)
Sensor Chip Package Assembly and Electronic Device Having Sensor Chip Package Assembly
Application: 15/611,766 →
Publication: US 2017/0271278
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 30, 2017
From: SHENZHEN HUIDING TECHNOLOGY CO., LTD.
To: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
Reel/Frame 043137/0514 →