IP Library › Assignment 042689/0277
Patent Assignment
Reel/Frame 042689/0277

Assignment of Assignor's Interest

Recorded: 2017-06-13 Pages: 3
Assignor
BORTHAKUR, SWARNAL
Executed: 2016-06-02
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Image Sensor Chip Scale Packages and Related Methods
Patent: 9,893,115 →
Application: 15/621,041 →
Publication: US 2017/0352698
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0594 →
Release of Security Interest in Patents Recorded at Reel 044481, Frame 0594 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: FAIRCHILD SEMICONDUCTOR CORPORATION; SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064074/0363 →