IP Library › Assignment 042735/0793
Patent Assignment
Reel/Frame 042735/0793

Assignment of Assignor's Interest

Recorded: 2017-06-16 Pages: 8
Assignors
MACHIDA, HIROKAZU
Executed: 2017-06-01
KITANO, KAZUHIKO
Executed: 2017-05-31
Assignee
J-DEVICES CORPORATION
1913-2 FUKURA, USUKI-CITY, OITA, 8750053, JAPAN
Covered Property (1)
Manufacturing Method of Semiconductor Package
Application: 15/625,464 →
Publication: US 2017/0365534
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 25, 2020
From: J-DEVICES CO., LTD.
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053597/0184 →
Corrective Assignment to Correct the Conveying Party Name Previously Recorded at Reel: 53597 Frame: 184. Assignor(S) Hereby Confirms the Assignment. Mar 5, 2021
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 055605/0060 →