Patent Assignment
Reel/Frame 042752/0522
Assignment of Assignor's Interest
Recorded: 2017-06-20
Pages: 2
Assignors
ICHIRYU, TAKASHI
Executed: 2017-04-26
KAWAKITA, KOJI
Executed: 2017-04-27
NOMURA, MASANORI
Executed: 2017-04-26
Assignee
PANASONIC CORPORATION
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Electronic Component Package Including Sealing Resin Layer, Metal Member, Ceramic Substrate, and Electronic Component and Method for Manufacturing the Same