Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and method for manufacturing the same

1. An electronic component package comprising:

a sealing resin layer;

a metal member buried in the sealing resin layer and including a die bond portion and a terminal electrode portion located outside the die bond portion;

a ceramic substrate buried in the sealing resin layer; and

an electronic component disposed on the die bond portion,

wherein when viewed in plan, the die bond portion and the ceramic substrate are partially overlapped and in contact with each other,

when viewed in plan, the terminal electrode portion and the ceramic substrate are partially overlapped and in contact with each other,

the electronic component and the terminal electrode portion are electrically connected to each other,

the metal member includes a first plating layer and a second plating layer disposed on the first plating layer, and

an average crystal grain diameter of the first plating layer is smaller than an average crystal grain diameter of the second plating layer.

2. The electronic component package according to claim 1 ,

wherein an outer edge of a bottom surface of the die bond portion and an outer edge of a top surface of the ceramic substrate are in contact with each other.

3. The electronic component package according to claim 1 ,

wherein an outer edge of a bottom surface of the die bond portion includes a first recess portion, and

the ceramic substrate includes a first portion which is disposed in the first recess portion.

4. The electronic component package according to claim 1 ,

wherein an outer edge of a bottom surface of the terminal electrode portion and an outer edge of a top surface of the ceramic substrate are in contact with each other.

5. The electronic component package according to claim 1 ,

wherein an outer edge of a bottom surface of the terminal electrode portion includes a second recess portion, and

the ceramic substrate includes a second portion which is disposed in the second recess portion.

6. The electronic component package according to claim 1 ,

wherein the die bond portion, the terminal electrode portion, and the ceramic substrate are flush with each other at a bottom surface of the electronic component package.

7. The electronic component package according to claim 1 ,

wherein the first plating layer of the die bond portion and the ceramic substrate are in contact with each other, and

the first plating layer of the terminal electrode portion and the ceramic substrate are in contact with each other.

8. The electronic component package according to claim 1 ,

wherein the electronic component includes a power semiconductor element.

9. The electronic component package according to claim 8 ,

wherein the power semiconductor element is a wide gap semiconductor element.

10. A method for manufacturing an electronic component package, the method comprising:

forming a die bond portion and a terminal electrode portion by performing a patterning treatment on a metal member bonded to a ceramic substrate on a carrier;

disposing an electronic component on the die bond portion;

forming a package precursor including the carrier, the ceramic substrate, the metal member, and the electronic component by forming a sealing resin layer on the carrier so as to cover at least the electronic component; and

peeling the carrier away from the package precursor.

11. The method for manufacturing an electronic component package according to claim 10 ,

wherein in the forming a die bond portion and a terminal electrode portion, a region of the metal member between the die bond portion and the terminal electrode portion is at least removed.

12. The method for manufacturing an electronic component package according to claim 10 ,

further comprising, before the forming a die bond portion and a terminal electrode portion, forming the metal member on the ceramic substrate by performing a plating treatment thereon.

13. The method for manufacturing an electronic component package according to claim 12 ,

wherein as the plating treatment, wet plating is performed after dry plating is performed.

14. The method for manufacturing an electronic component package according to claim 10 ,

further comprising, before the disposing an electronic component on the die bond portion, planarizing a surface of the die bond portion.

15. The method for manufacturing an electronic component package according to claim 10 ,

further comprising, before the forming a die bond portion and a terminal electrode portion, disposing the ceramic substrate on the carrier; and

after the disposing an electronic component on the die bond portion, electrically connecting the electronic component to the terminal electrode portion.

16. The method for manufacturing an electronic component package according to claim 10 ,

further comprising, before the forming a die bond portion and a terminal electrode portion, disposing on the carrier, the ceramic substrate and a first metal portion obtained by a method other than a plating treatment; and

forming a second metal portion covering the ceramic substrate and the first metal portion by performing a plating treatment,

wherein the metal member includes the first metal portion and the second metal portion.

17. The method for manufacturing an electronic component package according to claim 10 , wherein the sealing resin layer covers the terminal electrode portion.