Patent Assignment
Reel/Frame 042752/0714
Assignment of Assignor's Interest
Recorded: 2017-06-20
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Inspection Method, Inspection System, and Method of Manufacturing Semiconductor Package Using the Same