Patent Assignment
Reel/Frame 042756/0116
Assignment of Assignor's Interest
Recorded: 2017-06-20
Pages: 7
Assignors
TOSHIMA, HIROYUKI
Executed: 2017-05-29
HATANO, TATSUO
Executed: 2017-05-29
FURUKAWA, SHINJI
Executed: 2017-05-29
WATANABE, NAOKI
Executed: 2017-06-06
SUZUKI, NAOYUKI
Executed: 2017-05-29
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Method and Processing Apparatus for Performing Pre-Treatment to Form Copper Wiring in Recess Formed in Substrate