Patent Assignment
Reel/Frame 042756/0204
Assignment of Assignor's Interest
Recorded: 2017-06-20
Pages: 4
Assignors
UTSUMI, JUN
Executed: 2017-05-15
GOTO, TAKAYUKI
Executed: 2017-05-15
SUZUKI, TAKENORI
Executed: 2017-05-15
IDE, KENSUKE
Executed: 2017-05-15
Assignee
MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
130, ROKUJIZO, RITTO-SHI, SHIGA, 520-3080, JAPAN
Covered Property
(1)
Room-Temperature-Bonded Semiconductor Device and Manufacturing Method of Room-Temperature-Bonded Semiconductor Device