IP Library Assignment 042757/0904
Patent Assignment
Reel/Frame 042757/0904

Assignment of Assignor's Interest

Recorded: 2017-06-20 Pages: 7
Assignors
HIROSE, YOSHIRO
Executed: 2017-06-16
SANO, ATSUSHI
Executed: 2017-06-19
HARADA, KATSUYOSHI
Executed: 2017-06-19
Assignee
HITACHI KOKUSAI ELECTRIC INC.
15-12, NISHI-SHIMBASHI 2-CHOME, MINATO-KU, TOKYO, 105-8039, JAPAN
Covered Property (1)
Semiconductor Device Manufacturing Method, Substrate Processing Apparatus, and Recording Medium
Application: 15/627,828 →
Publication: US 2017/0294302
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0462 →