Patent Assignment
Reel/Frame 042761/0135
Assignment of Assignor's Interest
Recorded: 2017-06-20
Pages: 4
Assignors
WANG, SIAO-SHAN
Executed: 2017-04-12
WU, CHENG-HAN
Executed: 2017-04-12
CHANG, CHING-YU
Executed: 2017-04-12
LIN, CHIN-HSIANG
Executed: 2017-04-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Material Composition and Methods Thereof