Patent Assignment
Reel/Frame 042801/0981
Assignment of Assignor's Interest
Recorded: 2017-06-23
Pages: 4
Assignors
KIM, HYOUNG JOON
Executed: 2017-06-08
LEE, DOO HWAN
Executed: 2017-06-08
HARR, KYOUNG MOO
Executed: 2017-06-08
OH, KYUNG SEOB
Executed: 2017-06-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fan-Out Semiconductor Package and Method of Manufacturing the Fan-Out Semiconductor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.