Patent Assignment
Reel/Frame 042815/0795
Assignment of Assignor's Interest
Recorded: 2017-06-26
Pages: 3
Assignors
IKEDA, AYA
Executed: 2016-07-29
KATOU, SADAAKI
Executed: 2016-08-03
FUJII, SHINJIRO
Executed: 2016-08-03
HASHIMOTO, SHU
Executed: 2016-08-03
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Adhesive Composition, Method for Manufacturing Semiconductor Device Using Adhesive Composition, and Solid-State Imaging Element