Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
An adhesive composition comprising (a) an acrylic polymer having a weight-average molecular weight of 100000 or more, (b) a compound having at least two (meth)acryloyl groups and (c) a polymerization initiator, in which a structural unit having a nitrogen atom-containing group in the (a) acrylic polymer having a weight-average molecular weight of 100000 or more accounts for 5 mass % or less based on the total amount of the (a) acrylic polymer having a weight-average molecular weight of 100000 or more; and the (a) acrylic polymer having a weight-average molecular weight of 100000 or more has a structural unit having a functional group.
1. A method for manufacturing a semiconductor device comprising:
a step of forming an adhesive layer of an adhesive composition on a semiconductor substrate, the adhesive composition comprising:
(a) an acrylic polymer having a weight-average molecular weight of 100000 or more,
(b) a compound having at least two (meth)acrylol groups, and
(c) a polymerization initiator, wherein
a structural unit having a nitrogen atom-containing group in the (a) acrylic polymer having a weight-average molecular weight of 100000 or more accounts for 5 mass % or less based on a total amount of the (a) acrylic polymer having a weight-average molecular weight of 100000 or more, and
the (a) acrylic polymer having a weight-average molecular weight of 100000 or more has a structural unit having a functional group,
a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and
a step of curing the adhesive layer.
2. The method for manufacturing a semiconductor device according to claim 1 , further comprising (d) an antioxidant.
3. The method for manufacturing a semiconductor device according to claim 1 , wherein the semiconductor device is an optical part.
4. The method for manufacturing a semiconductor device according to claim 1 , wherein the functional group includes an epoxy group.
5. The method for manufacturing a semiconductor device claim 4 , further comprising (d) an antioxidant.
6. The method for manufacturing a semiconductor device according to claim 1 , wherein the (a) acrylic polymer having a weight-average molecular weight of 100000 or more contains a structural unit having an alicyclic structure.
7. The method for manufacturing a semiconductor device according to claim 6 , wherein the functional group includes an epoxy group.
8. The method for manufacturing a semiconductor device according to claim 6 , further comprising (d) an antioxidant.
9. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of an adhesive composition comprising:
(a) an acrylic polymer having a weight-average molecular weight of 100000 or more,
(b) a compound having at least two (meth)acrylol groups, and
(c) a polymerization initiator, wherein
a structural unit having a nitrogen atom-containing group in the (a) acrylic polymer having a weight-average molecular weight of 100000 or more accounts for 5 mass % or less based on a total amount of the (a) acrylic polymer having a weight-average molecular weight of 100000 or more, and
the (a) acrylic polymer having a weight-average molecular weight of 100000 or more has a structural unit having a functional group.
10. The solid-state imaging element according to claim 9 , further comprising (d) an antioxidant.
11. The solid-state imaging element according to claim 9 , wherein the functional group includes an epoxy group.
12. The solid-state imaging element according to claim 11 , further comprising (d) an antioxidant.
13. The solid-state imaging element according to claim 9 , wherein the (a) acrylic polymer having a weight-average molecular weight of 100000 or more contains a structural unit having an alicyclic structure.
14. The solid-state imaging element according to claim 13 , wherein the functional group includes an epoxy group.
15. The solid-state imaging element according to claim 13 , further comprising (d) an antioxidant.