Patent Assignment
Reel/Frame 042817/0538
Assignment of Assignor's Interest
Recorded: 2017-06-26
Pages: 2
Assignor
SORIMACHI, HARUO
Executed: 2017-04-24
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Semiconductor Device