IP Library › Assignment 042819/0339
Patent Assignment
Reel/Frame 042819/0339

Assignment of Assignor's Interest

Recorded: 2017-06-26 Pages: 4
Assignors
KIM, HYOUNG JOON
Executed: 2017-06-08
OH, KYUNG SEOB
Executed: 2017-06-08
HARR, KYOUNG MOO
Executed: 2017-06-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Fan-Out Semiconductor Package
Application: 15/633,478 →
Publication: US 2018/0090402
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →