Patent Assignment
Reel/Frame 042853/0445
Assignment of Assignor's Interest
Recorded: 2017-06-28
Pages: 5
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Method for Fabricating Handling Wafer
Patent:
10,109,474 →
Application:
15/603,046 →