Patent Assignment
Reel/Frame 042875/0270
Assignment of Assignor's Interest
Recorded: 2017-06-30
Pages: 4
Assignors
HUANG, SUNG-HUI
Executed: 2017-06-21
YU, DA-CYUAN
Executed: 2017-06-21
HUANG, KUAN-YU
Executed: 2017-06-21
LI, PAI YUAN
Executed: 2017-06-21
LEE, HSIANG-FAN
Executed: 2017-06-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Thermal Interface Material Having Different Thicknesses In Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.