Patent Assignment
Reel/Frame 042901/0829
Assignment of Assignor's Interest
Recorded: 2017-07-05
Pages: 4
Assignee
SUMITOMO ELECTRIC INDUSTRIES, LTD.
5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI, OSAKA, 541-0041, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Substrate, Semiconductor Substrate, Method for Manufacturing Combined Semiconductor Substrate, Combined Semiconductor Substrate, and Semiconductor-Joined Substrate