Patent Assignment
Reel/Frame 042977/0992
Assignment of Assignor's Interest
Recorded: 2017-07-11
Pages: 3
Assignee
NEPES CO., LTD.
105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON, EUMSEONG-GUN, CHUNGCHEONGBUK-DO, 369-832, KOREA, REPUBLIC OF
Covered Property
(1)
Stacked Semiconductor Package and Manufacturing Method Thereof