Patent Assignment
Reel/Frame 042979/0962
Assignment of Assignor's Interest
Recorded: 2017-07-11
Pages: 3
Assignor
HUNG, CHING-WEN
Executed: 2017-07-07
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method of Fabricating Iii-V Fin Structures and Semiconductor Device with Iii-V Fin Structures
Patent:
10,062,577 →
Application:
15/647,232 →