Patent Assignment
Reel/Frame 042986/0184
Assignment of Assignor's Interest
Recorded: 2017-07-12
Pages: 3
Assignors
NAKATSUJI, HIROSHI
Executed: 2017-07-07
YOSHIZAWA, KAZUTAKA
Executed: 2017-07-07
OGAWA, HIROYUKI
Executed: 2017-07-10
Assignee
SANDISK TECHNOLOGIES LLC
6900 NORTH DALLAS PARKWAY, SUITE 325, PLANO, TEXAS, 75024
Covered Property
(1)
Three-Dimensional Memory Device Containing Hydrogen Diffusion Barrier Layer for Cmos Under Array Architecture and Method of Making Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →