Patent Assignment
Reel/Frame 043025/0289
Assignment of Assignor's Interest
Recorded: 2017-07-17
Pages: 8
Assignors
SHEN, HONG
Executed: 2015-07-28
WOYCHIK, CHARLES G.
Executed: 2015-07-28
SITARAM, ARKALGUD R.
Executed: 2015-07-28
GAO, GUILIAN
Executed: 2015-07-23
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Integrated Interposer Solutions for 2D and 3D Ic Packaging
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0668 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0751 →