Integrated interposer solutions for 2D and 3D IC packaging
An integrated circuit (IC) package includes a first substrate having a backside surface and a top surface with a cavity disposed therein. The cavity has a floor defining a front side surface. A plurality of first electroconductive contacts are disposed on the front side surface, and a plurality of second electroconductive contacts are disposed on the back side surface. A plurality of first electroconductive elements penetrate through the first substrate and couple selected ones of the first and second electroconductive contacts to each other. A first die containing an IC is electroconductively coupled to corresponding ones of the first electroconductive contacts. A second substrate has a bottom surface that is sealingly attached to the top surface of the first substrate, and a dielectric material is disposed in the cavity so as to encapsulate the first die.
1. A method for making an integrated circuit (IC) package, the method comprising:
providing a first substrate having a back side surface, a top surface and a cavity disposed in the top surface, the cavity having a floor defining a front side surface;
forming electroconductive contacts on respective ones of the front and back side surfaces;
forming a plurality of electroconductive elements penetrating through the first substrate and interconnecting selected ones of the electroconductive contacts respectively disposed on the front and back side surfaces to each other;
obtaining one or more first dies, and electroconductively coupling each first die to corresponding ones of the electroconductive contacts disposed on the front side surface, each first die containing an IC;
permanently sealingly attaching a bottom surface of a second substrate to the top surface of the first substrate;
before the attaching of the bottom surface of the second substrate to the top surface of the first substrate, processing a top surface of at least one first die to reduce a final thickness of the IC package;
after said permanently sealingly attaching the bottom surface of the second substrate to the top surface of the first substrate, applying a thinning process to the back side surface of the first substrate to further reduce the final thickness of the IC package.
2. The method of claim 1 wherein the processing of the top surface of the at least one first die comprises etching the top surface of the at least one first die.
3. The method of claim 1 wherein the processing of the top surface of the at least one first die comprises mechanical polishing of the top surface of the at least one first die.
4. The method of claim 1 wherein the processing of the top surface of the at least one first die comprises chemical mechanical polishing of the top surface of the at least one first die.
5. The method of claim 1 further comprising processing the top surface of the first substrate during the processing of the top surface of the at least one first die, the processing of the top surface of the first substrate being to reduce the final thickness of the IC package.
6. The method of claim 5 wherein the processing of the top surface of at least one first die and the processing of the top surface of the first substrate comprise grinding the top surfaces of the at least one first die and the first substrate to make them coplanar with each other and to reduce a final thickness of the IC package.
7. The method of claim 1 wherein the plurality of electroconductive elements penetrating through the first substrate are formed after applying the thinning process.
8. The method of claim 7 wherein forming the plurality of electroconductive elements comprises:
forming through-holes in the back side surface of the first substrate; and
forming electroconductive material in the through-holes.
9. The method of claim 1 wherein forming the plurality of electroconductive elements comprises:
providing the electroconductive elements before said permanently sealingly attaching the bottom surface of the second substrate to the top surface of the first substrate; and
revealing the electroconductive elements by the thinning process.
10. The method of claim 1 wherein each said electroconductive contact formed on the back side surface is formed after said permanently sealingly attaching the bottom surface of the second substrate to the top surface of the first substrate.
11. The method of claim 1 wherein each said electroconductive contact formed on the back side surface is formed after said thinning process.
12. The method of claim 1 further comprising permanently sealingly attaching the bottom surface of the first substrate to a top surface of at least one first die.
13. A method for making an integrated circuit (IC) package, the method comprising:
providing a first substrate having a back side surface, a top surface and a cavity disposed in the top surface, the cavity having a floor defining a front side surface;
forming a plurality of first electroconductive contacts on the front side surface;
obtaining one or more first dies, and electroconductively coupling each first die to corresponding ones of the first electroconductive contacts, each first die containing an IC;
after said electroconductively coupling each first die, processing a top surface of at least one first die to reduce a final thickness of the IC package;
permanently sealingly attaching a bottom surface of a second substrate to the top surface of the first substrate; and
after said permanently sealingly attaching the bottom surface of the second substrate to the top surface of the first substrate, forming a plurality of second electroconductive contacts on the back side surface and a plurality of electroconductive elements penetrating through the first substrate and interconnecting selected ones of the first electroconductive contacts and the second electroconductive contacts to each other;
wherein forming a plurality of the second electroconductive contacts and a plurality of electroconductive elements comprises:
forming a plurality of through-holes in the first substrate; and
forming the electroconductive elements in the through-holes.
14. The method of claim 13 further comprising permanently sealingly attaching the bottom surface of the first substrate to a top surface of at least one first die.
15. A method for making an integrated circuit (IC) package, the method comprising:
providing a first substrate having a back side surface, a top surface and a cavity disposed in the top surface, the cavity having a floor defining a front side surface;
forming electroconductive contacts on respective ones of the front and back side surfaces;
forming a plurality of electroconductive elements penetrating through the first substrate and interconnecting selected ones of the electroconductive contacts respectively disposed on the front and back side surfaces to each other;
obtaining one or more first dies, and electroconductively coupling each first die to corresponding ones of the first electroconductive contacts, each first die containing an IC;
after said electroconductively coupling each first die, processing a top surface of at least one first die to reduce a final thickness of the IC package;
permanently sealingly attaching a bottom surface of a second substrate to a top surface of at least one first die, the bottom surface of the second substrate covering the cavity; and
after said permanently sealingly attaching the bottom surface of the second substrate to the top surface of at least one first die, applying a thinning process to the back side surface of the first substrate to further reduce the final thickness of the IC package.
16. The method of claim 15 wherein the plurality of electroconductive elements penetrating through the first substrate are formed after applying the thinning process.
17. The method of claim 16 wherein forming the plurality of electroconductive elements comprises:
forming through-holes in the back side surface of the first substrate; and
forming electroconductive material in the through-holes.
18. The method of claim 15 wherein forming the plurality of electroconductive elements comprises:
providing the electroconductive elements before said permanently sealingly attaching the bottom surface of the second substrate to the top surface of the first substrate; and
revealing the electroconductive elements by the thinning process.
19. The method of claim 15 wherein each said electroconductive contact formed on the back side surface is formed after said permanently sealingly attaching the bottom surface of the second substrate to the top surface of the first substrate.
20. The method of claim 15 wherein each said electroconductive contact formed on the back side surface is formed after said thinning process.