IP Library › Assignment 043035/0217
Patent Assignment
Reel/Frame 043035/0217

Assignment of Assignor's Interest

Recorded: 2017-07-18 Pages: 4
Assignors
MEADE, ROY E.
Executed: 2016-08-31
PANDEY, SUMEET C.
Executed: 2016-08-29
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 525, BOISE, IDAHO, 83707-0006
Covered Property (1)
Methods of Forming Semiconductor Device Structures Including Two-Dimensional Material Structures
Patent: 9,991,122 →
Application: 15/253,454 →
Publication: US 2018/0061665
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 2 to Patent Security Agreement Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041671/0902 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050680/0268 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →