Patent Assignment
Reel/Frame 043048/0622
Assignment of Assignor's Interest
Recorded: 2017-07-19
Pages: 3
Assignor
WANG, WEI-JEN
Executed: 2017-07-14
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and a Method of Manufacturing the Same