Patent Assignment
Reel/Frame 043052/0951
Assignment of Assignor's Interest
Recorded: 2017-07-20
Pages: 6
Assignors
SUNDAR, VIGNESH
Executed: 2017-06-05
WANG, YU-JEN
Executed: 2017-06-05
SHEN, DONGNA
Executed: 2017-06-05
PATEL, SAHIL
Executed: 2017-06-05
TONG, RU-YING
Executed: 2017-06-05
Assignee
HEADWAY TECHNOLOGIES, INC.
678 SOUTH HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Silicon Oxynitride Based Encapsulation Layer for Magnetic Tunnel Junctions
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 25, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048692/0917 →
Assignment of Assignor's Interest
Oct 26, 2022
From: SUNDAR, VIGNESH; WANG, YU-JEN; SHEN, DONGNA; PATEL, SAHIL
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 061549/0025 →
Assignment of Assignor's Interest
Oct 27, 2022
From: SUNDAR, VIGNESH; WANG, YU-JEN; SHEN, DONGNA; PATEL, SAHIL
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 061563/0803 →