Patent Assignment
Reel/Frame 061563/0803
Assignment of Assignor's Interest
Recorded: 2022-10-27
Pages: 6
Assignors
SUNDAR, VIGNESH
Executed: 2017-06-05
WANG, YU-JEN
Executed: 2017-06-05
SHEN, DONGNA
Executed: 2017-06-05
PATEL, SAHIL
Executed: 2017-06-05
TONG, RU-YING
Executed: 2017-06-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Silicon Oxynitride Based Encapsulation Layer for Magnetic Tunnel Junctions
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 20, 2017
From: SUNDAR, VIGNESH; WANG, YU-JEN; SHEN, DONGNA; PATEL, SAHIL
To: HEADWAY TECHNOLOGIES, INC.
Reel/Frame 043052/0951 →
Assignment of Assignor's Interest
Mar 25, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 048692/0917 →
Assignment of Assignor's Interest
Oct 26, 2022
From: SUNDAR, VIGNESH; WANG, YU-JEN; SHEN, DONGNA; PATEL, SAHIL
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 061549/0025 →